KAOHSIUNG, Oct. 5, 2026 /PRNewswire/ — E&R Engineering Corp., (TWSE: 8027) an international provider of semiconductor packaging equipment, announced today the upcoming grand opening of its new Malaysian subsidiary—E&R SEMICONDUCTOR (MALAYSIA) SDN. BHD.—at the Melaka Free Trade Zone on October 13.
E&R Engineering Opens New Malaysia Plant to Strengthen Semiconductor Packaging Support
To meet surging Southeast Asian demand, E&R Engineering is upgrading its global strategy for the packaging materials business unit. While its plant in China continues to experience steady business growth, E&R is strategically shifting a portion of its production focus to Malaysia while expanding overall capacity. The new facility is currently undergoing sample testing and qualification, with mass production scheduled to begin early next year. The plant is expected to create 50 local job opportunities and strengthen E&R’s supply capabilities for semiconductor and OSAT customers in Southeast Asia.
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