KUALA LUMPUR: Japanese metal materials manufacturer Mitsui Kinzoku Co Ltd plans to invest about RM4.87 billion to build a new copper foil manufacturing plant in Malaysia to capitalise on growing demand from the artificial intelligence (AI) and semiconductor industries.
In a company notice, Mitsui Kinzoku said the new plant will be built near its existing subsidiary, Mitsui Copper Foil (Malaysia) Sdn Bhd, in Shah Alam.
The plant will manufacture MicroThin carrier-supported ultra-thin copper foil and VSP electrode posited copper foil, which are used in semiconductor packaging and high-frequency circuit boards, respectively.
Operations are scheduled to begin in phases from April 2031, the company said.
