PETALING JAYA: Japanese metals producer Mitsui Kinzoku Co Ltd will invest ¥190 billion (RM4.87 billion) to construct a new copper foil manufacturing plant in Malaysia, as it seeks to capitalise on growing demand from the artificial intelligence (AI) and semiconductor industries.
In a statement dated Nov 10, 2026, the company said its board of directors had resolved at a meeting held that day to construct the new plant and acquire the related fixed assets. The investment amounts to approximately ¥190 billion.
The new facility will be built near Mitsui Copper Foil (Malaysia) Sdn Bhd, a Malaysian subsidiary of the group, although the exact location has not been disclosed.
The plant will manufacture MicroThin carrier-supported ultra-thin copper foil and VSP electrodeposited copper foil for high-frequency circuit boards.
